Hisense Signs Indonesia Cooperation Deal

Hisense Group and Indonesia’s BPI Danantara signed a strategic cooperation memorandum in Jakarta on May 16, 2026, to expand industrial, technology and research cooperation in Indonesia.

Prabowo Subianto, President of Indonesia, and Shaoqian Jia, Chairman of Hisense Group, witnessed the signing ceremony.

The agreement said both sides will pursue cooperation in advanced manufacturing, technology localisation, research and development innovation, and industrial capacity building in Indonesia.

The partners said they aim to establish technical research centres in Indonesia, conduct localised research and development, develop professional talent, and support local industrial transformation and upgrading.

BPI Danantara is Indonesia’s national investment management institution. The organisation oversees state-owned enterprises and manages major national strategic investments, according to the press release.

Hisense said its business covers smart home appliances, semiconductors, smart energy, automotive electronics and laser display. The company said it has 30 research and development centres and 37 manufacturing bases worldwide.